Discover the world of Scanning Acoustic Microscopy

The unique characteristic of Scanning Acoustic Microscopy is its ability to non-destructively examine the interior of opaque materials with the resolution of optical light microscopy. New ways of thinking and visionary ideas are behind our successful concepts of trend-setting scanning acoustic microscopy technologies.

In almost all fields of modern science and technology the demands for innovative, advanced solutions for non-destructive imaging with scanning acoustic microscopy have increased. PVA TePla Analytical Systems develops, produces and delivers scanning acoustic microscopes. Our unique transducers with frequencies from 3 to 2000 MHz extend imaging and analytical resolution beyond previously achievable limits.

PVA Tepla Analytical Systems GmbH works successfully on the development and production of next generation scanning acoustic microscopes.



We are privileged to be part of the European joint project, Metro4-3D (Metrology for future 3D-technologies) which aims to maintain a strong position in the metrology area for semiconductor industry. PVA TePla Analytical Systems GmbH’s main objective on this joint project is to detect internal defects in the BEOL layers, Through-Si Vias (TSV’s) and micro-bumps as well as voids or cracks in stacked dies and wafers using a GHz Scanning Acoustic Microscope. To learn more about Metro4-3D, go to