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Industrial application
Semiconductor application
Life science application
Micro cracks in the buffer
layer of a ball bearing.
Delamination inside the die-structure
of an integrated circuit.
Acoustic image of the interface
area
between enamel and
dentine of a
human tooth.
Grain structure
of an AlMg-alloy.
Acoustic image of bumps
on a flip-chipstructure.
Acoustic image of a
cortical bone
structure.
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