First 8 inch/12 inch bridge tool auto wafer
Scanning Acoustic Microscope launched!

PVA TePla Analytical Systems has launched a new combined
8 inch/12 inch auto wafer Scanning Acoustic Microscope (SAM).
This development follows the roadmap for fully automated production inspection tools for MEMS inspection.

The system operates using a 300 mm robot with a combined
8/12 inch wafer chuck, the load port is capable to use 12 inch and
8 inch wafer cassettes. The inspection of 8 and 12 inch wafers is possible without any hardware change.

Different inspection recipts are loaded by software commands sent by GEM/SECS host or windows commands.

New SAM analysis software for failure analysis and research applications launched!

Analysis Methods:
Time of Flight Analysis, sliding window Analysis
Thickness estimation, sound velocity estimation
Delamination analysis, - numerical deconvolution algorithms for extended delamination evaluation
BAI analysis method for imaging internal structures and deviations with enhanced contrast
Application of sophisticated spectral analysis methods
Numerical deconvolution algorithms for extended delamination evaluation

Internal imaging
3-D Volume Analysis and Imaging
3-D rendering of internal structures and surfaces