We are privileged to be part of the European joint project, Metro4-3D (Metrology for future 3D-technologies) which aims to maintain a strong position in the metrology area for semiconductor industry. PVA TePla Analytical Systems GmbH’s main objective on this joint project is to detect internal defects in the BEOL layers, Through-Si Vias (TSV’s) and micro-bumps as well as voids or cracks in stacked dies and wafers using a GHz Scanning Acoustic Microscope. To learn more about Metro4-3D, go to